The 2.3 MW model extends Vertiv's liquid-cooling portfolio for edge, colocation and hyperscale AI deployments
COLUMBUS, Ohio (September 21, 2026) – Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, today announced the 2.3 MW Vertiv CoolChip coolant distribution unit (CDU) model has qualified as a NVIDIA DSX Ready CDU. The 2.3 MW CDU model is the first CDU to qualify specifically as NVIDIA DSX Ready.
Vertiv is among the initial providers of qualified CDU solutions in the NVIDIA DSX Ready program, which enables AI factory builders to identify specific power and cooling products that meet applicable NVIDIA DSX requirements.
"The scale of AI deployment is forcing a more integrated approach to data center infrastructure," said Scott Armul, Chief Product and Technology Officer of Vertiv. "Compute, power and cooling decisions can no longer be made independently. A constraint on any one of those systems can limit the performance and productive capacity of the entire facility."
A coolant distribution unit, or CDU, manages the flow and temperature of liquid used to remove heat from high-density computing systems. The DSX Ready 2.3 MW model is part of Vertiv's liquid-to-liquid CDU portfolio, supporting direct-to-chip and rear-door heat exchanger applications and designed for installation at the end of a row or along the room perimeter.
The NVIDIA DSX AI Factory Platform unifies AI factory design and operations across compute, networking, power, cooling, facilities and software. NVIDIA DSX Ready connects specific products to applicable NVIDIA DSX requirements.